EMI & Thermal Shielding
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Description
Two critical issues for the electronics packaging engineer are electromagnetic interference (EMI) and heat dissipation.
EMI Shielding
With such a wide variety in modern integrated circuit packages, creative EMI shielding becomes increasingly critical. Additionally, today's electronic equipment must meet global regulations that make a given device more susceptible to internal and external EMI emissions. Many packages have space or closure force needs beyond standard specifications. Greene Rubber Company offers capabilities beyond standard gaskets to create innovative solutions to EMI shielding problems.
Thermals
As any designer knows, heat can degrade component and system performance. These problems become more severe with even greater speed and processing power squeezed into small devices. That is why we offer a variety of highly technical interface materials that offer superior heat spreading and conductivity into the interface, virtually eliminating air gaps and vastly improving thermal transfer.
EMI Shielding
With such a wide variety in modern integrated circuit packages, creative EMI shielding becomes increasingly critical. Additionally, today's electronic equipment must meet global regulations that make a given device more susceptible to internal and external EMI emissions. Many packages have space or closure force needs beyond standard specifications. Greene Rubber Company offers capabilities beyond standard gaskets to create innovative solutions to EMI shielding problems.
Thermals
As any designer knows, heat can degrade component and system performance. These problems become more severe with even greater speed and processing power squeezed into small devices. That is why we offer a variety of highly technical interface materials that offer superior heat spreading and conductivity into the interface, virtually eliminating air gaps and vastly improving thermal transfer.
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EMI & Thermal Shielding
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